And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback