The ‘Intel Accelerated' webcast kicked off today, hosted by newly-minted CEO Pat Gelsinger and Dr. Ann Kelleher, SVP and general manager of Technology Development. The dynamic duo disclosed a number ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

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For the first time in decades, Intel is playing from behind in the race to cram smaller and smaller transistors on squares of silicon. But the semiconductor giant recently rolled out one of its most ...

Now that it's 2024, Intel's "five nodes in four years" strategy will start picking up steam. The company has multiple CPUs on new processes lined up for launch this year for client and server. Now ...

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

Yesterday, we reported a few key details of Intel's next-gen CPUs which feature a very LEGO-Esque design thanks to the 3D Foveros packaging technology. The new CPUs that will be putting the tech to ...

Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

VIDEOS: Intel announces accelerated process and packaging innovations to power 'next wave of products through 2025 and beyond" Despite getting its butt seriously kicked by AMD, Apple, TSMC and others, ...

Intel has detailed a slew of process and packaging innovations as part of its integrated device manufacturing (IDM) 2.0 strategy during its Intel Accelerated webcast today. These innovations give us a ...