One day [Andy] was cruising around eBay and spotted something interesting. Forty Virtex-E FPGAs for two quid each. These are the big boys of the FPGA world, with 512 user IO pins, almost 200,000 logic ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
TL;DR: LG Innotek's new Copper Post technology replaces traditional solder balls with copper columns, enabling 20% denser chip packaging for thinner smartphones. This innovation improves heat ...
Intel’s dual-core processors have been described as “nothing short of amazing” by reverse engineering firm Chipworks, following analysis of the Presler processor core. Presler, at the core of Intel’s ...
Can unleaded BGA solder balls potentially grow tin whiskers as tin plated leads do? Annealing seems to be the standard approach for pure tin plated lead devices, but what about BGAs? Are unleaded BGA ...
Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...
ANAHEIM, Calif. — Agilent Technologies Inc. continues to try and bring electronics manufacturing test into the third dimension. The Palo Alto, Calif.-based ATE company unveiled the SJ50 Series II, its ...
Tessera this morning announced an alternative to ubiquitous ball-grid technology that could significantly change both chip-scale packaging and more complex assemblies such as package-in-package ...
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