IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...
System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Weltrend announced its first GaN-based system-in-package integrating an AC/DC controller and Transphorm’s 240-mΩ, 650-V SuperGaN FET. The WT7162RHUG24A is intended for USB Type- C Power Delivery (PD) ...
The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...
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