The latest system-on-a-chip (SOC) and system-in-a-package (SIP) devices combine microelectromechanical systems, optoelectronic components, sensors, and traditional circuits in a single package.
Fairchild Semiconductor Introduces Most Highly Integrated System-In-A-Package Ballast IC for Compact
Fairchild Semiconductor (NYSE: FCS) has introduced the FAN7710, the most highly integrated ballast IC on the market specifically developed for compact fluorescent lamp (CFL) designs. Offering a ...
The MLX91801/2 is a System in a Package (SIP) combining an analog pressure sensor and a low-power sensor interface with an MLX16 micro-controller in a custom, pressure ported, plastic SO16 package.
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