The latest financial results from Taiwan Semiconductor Manufacturing Company (TSMC) show demand for AI and high-performance computing (HPC) is compelling and expected to stay that way – without ...

As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers has emerged. To ...

TSMC , the world's largest contract chipmaker, expects the global semiconductor market to exceed $1.5 trillion by 2030, topping its previous forecast ​of $1 trillion, according to its presentation ...

TSM has already climbed 40% in 2026. Here's why the company sees rapid demand growth ahead.

TSMC is stuffed to the rafters with CoWoS orders, and the AI industry is sweating over it, although the company seems to have a cunning plan. Advanced packaging has become the holy grail for cramming ...

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the high-margin work under its own roof. Now, for the first time, the world’s ...

Taiwan manufacturing capacity Taiwan is the world’s most critical semiconductor manufacturing hub. In 2025 its economy grew ...

Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated capability—advanced packaging. While Taiwan ...

Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the ...

Taiwanese chip designer MediaTek said it has appointed former TSMC executive ​Douglas Yu as a part-time adviser ‌as it steps up advanced packaging work and expands into the AI chip market.

In TSMC's latest long-range outlook, management now sees the 2030 chip market topping $1.5 trillion, with 55% of demand tied to AI and high-performance computing. That marks a major shift from the ...