The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5D/3D-IC multi-die systems, which extends product reliability Ansys Mechanical is ...
Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials ...
Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together ...
Mechanical Engineering Professor Alan McGaughey of Carnegie Mellon University recently coordinated the Phonon Olympics, ...
Engineers often consider thermal management and cooling as a two-part problem. First, there’s the global “macro” case where no individual component is excessively hot, but the aggregate heat buildup ...
PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...
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