At the recent 2026 IEEE Electronic Components and Technology Conference (ECTC), imec and EV Group presented a robust and ...

CEA-Leti has announced a major milestone in the evolution of 3D integration for high-performance computing (HPC), advanced ...

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...

A new technical paper titled “Assessment of wafer-level transfer techniques of graphene with respect to semiconductor industry requirements” was published by researchers at RWTH Aachen University, AMO ...

Wafer bonding underpins the integration of diverse semiconductor materials into unified platforms, enabling three-dimensional stacking and heterogeneous assembly of components with disparate lattice ...

FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) EV Group (EVG), a ...

MINNEAPOLIS — FSI International Inc. here today entered the automated immersion wafer cleaning market with the introduction of a tool for 300-mm wafer fab applications. FSI's tool, dubbed the Magellan ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...