MUNICH — Suss MicroTec Systems GmbH today announced an expansion in spin-coating, developing, and wafer-mounting systems with the acquisition of B.L.E. Laboratory Equipment GmbH of Singen, Germany.

Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Continuing increases in the speed of semiconductor devices combined with higher levels of integration, on-chip wireless functions, and the usage of mixed-signal-device designs are driving new ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

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