Researchers at ETH Zürich and New York University published a technical paper titled “Understanding the Power Consumption of ...

Plus, agentic EDA and AI-generated analog layout, small chip fabs, diamond-based defect inspection, large-area nanoimprint ...

The shift-left approach to via optimization involves a specialized enhancement platform that operates on the design database ...

Champaign, National Energy Technology Laboratory, Argonne National Laboratory, and Monash University published a technical ...

Thermal instability has been a concern for CPO technology. Ayar Labs and Global Unichip Corp. (GUC) jointly conducted thermal ...

Increasing complexity requires thermal, electrical, and mechanical effects to be analyzed together. Complex designs now ...

Because in the age of AI, performance is no longer determined by a single chip itself. It is shaped by how efficiently the ...

Open interfaces and interoperability allow designers to choose technologies based on the needs of the system. AI ...

Closing the visibility gap looks different as a result. The goal isn’t one test, model, sensor, or inspection system that somehow sees everything. It’s getting better at recognizing what each view can ...

Synopsys CEO Sassine Ghazi talks about AI agents, the limits of autonomous engineering, digital twins, and the challenges ...

Researchers at Georgia Institute of Technology published a technical paper titled “Low-loss ultra-compact photonic bends with enhanced fabrication tolerance for commercial foundry processes.” Abstract ...

Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...