Wajih Daab, Senior Director of Product Management at Luna Innovations, explained that AI is driving huge demand for optical interconnects, and that testing is becoming the bottleneck. As co-packaged ...

Deutsche Telekom, Orange, Telefónica, and Vodafone have signed an MoU to pursue a joint bid for MSS spectrum, aiming to bring resilient D2D satellite services to Europe (Credit: Deutsche Telekom, ...

EXFO introduces the HyperBlazer Series, offering 10-second health checks and automated diagnostics to recover sidelined 400G/800G optics and streamline DCI turn-up. Join 12,000+ fibre optics ...

GlobalFoundries and TSMC's $2bn partnership strengthens U.S. semiconductor resilience and expands CoWoS advanced packaging capacity for AI accelerators. Join 12,000+ fibre optics professionals ...

Cyprus operator Cablenet is leveraging Harmonic's cOS platform, Oyster nodes, and DOCSIS 3.1+ to modernise its broadband network (Credit: Red Tiger / Shutterstock.com) ...

Marvell announces second-generation Structera X CXL memory expanders featuring six channels, PCIe Gen 6, and inline compression to solve AI memory bottlenecks. Join 12,000+ fibre optics professionals ...

Fibre Systems Autumn 2026 examines how 1.6T optics, architectural rethinks, and fibre innovation are being pressed into service to solve AI's physical-layer bottleneck, as the industry converges on ...

Network X is bringing together 5,500+ attendees, including 1,500+ telcos and 300+ visionary speakers. Helping telecom leaders navigate the growing complexity of network transformation in an era of ...

TE Connectivity (TE) leveraged its presence at OFC 2026 to showcase potential breakthrough solutions addressing some of the most pressing connectivity challenges in next-generation data centres, from ...

At ECOC this year, Coherent emphasised its commitment to the AI and data centre market with the launch of a new platform, PhotonLink. Sanjai Parthasarathi, chief marketing officer, says that the ...