Abstract: With the continuous development of packaging technology and substrate technology, more and more functions are integrated into components and substrates, such as antenna on package and ...

Abstract: The mismatch in coefficients of thermal expansion (CTE) among materials in silicon carbide (SiC) power modules during reflow soldering leads to significant warpage of the Direct Bonded ...

One of the easiest soldering projects to do as a beginner is to solder a resistor to an LED. You can technically put the resistor on either side, but I typically choose to put it on the long leg of ...