Oct-15th-2025-- GlobalFoundries has been selected as the technology provider and operator for two new semiconductor fabs ...

SEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149 ...

ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate ...

Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...

Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the ...

Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Choosing an Arm CPU core starts with the workload, not with the processor name. The right core depends on what the chip must do, the software it must run, the power and area available, whether ...

TSMC reported US$40.2 billion in second-quarter revenue and a 60.3% operating margin. High-performance computing accounted for two-thirds of revenue, while 2nm made its first measurable contribution ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during ...

Finding experienced ASIC verification engineers can be difficult when your chip project requires strong UVM, SystemVerilog, coverage, formal verification, protocol knowledge or complex SoC-level debug ...