Oct-15th-2025-- GlobalFoundries has been selected as the technology provider and operator for two new semiconductor fabs ...
SEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149 ...
Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the ...
ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate ...
Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...
Choosing an Arm CPU core starts with the workload, not with the processor name. The right core depends on what the chip must do, the software it must run, the power and area available, whether ...
GlobalFoundries Wins $2 Billion TSMC CoWoS Interposer Deal, Expanding U.S. Advanced Packaging Supply
GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...
Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...
An MPW run is one of the most cost-effective ways to manufacture first silicon when you do not yet need a full dedicated wafer lot. MPW stands for Multi-Project Wafer. Instead of one customer paying ...
Espoo, Finland – October 5, 2026 – Xiphera announces the launch of nQrux® Root of Trust, the latest addition to its nQrux® product family. Designed for ASIC and SoC implementations, the new IP ...
Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during ...
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