Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies.

For today’s multi-kilowatt AI servers, 48 V therefore represents a practical intermediate point. It substantially reduces current compared with 12 V, remains compatible with modular rack-level power ...

Cleanova has acquired California-based SV Techsol, expanding its engineering and environmental control capabilities for semiconductor manufacturing and other ultra-clean applications.

The next decade of AI infrastructure will certainly require more compute. But according to Scalia, the real innovation will occur in the interconnected layers that power, manage and optimise it. And ...

With dies embedded directly into a silicon wafer, onsemi is targeting higher density, better thermal performance and tighter integration in AI and electric vehicle applications.

Previous development work by ZuriQ and Infineon demonstrated the feasibility of this novel architecture by trapping a 3×3 array of nine individually controlled ions, achieving the largest ...

This year, engineering technologies business, Renishaw, is celebrating the 15th anniversary of the purchase of its Miskin site in South Wales, and the completion of the first phase of a further £70 ...

At SEMICON West, Festo featured a range of solutions based on Controlled Pneumatics, a new generation of digital-pneumatic valve technology that advances pressure, flow, and motion regulation to ...

Mueon Corporation, a semiconductor systems company building a new modular foundation for AI and hyperscale computing, has announced $65 million raised in a Series A. Maverick Silicon led the financing ...

Nordson Test & Inspection will showcase its portfolio of optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence™ Ecosystem at SEMICON Europe 2026, November ...