Design And Reuse

Codebat Publishes Development Timeline for Its NIST CAVP-Validated ML-DSA Hardware Engine

Codebat Technologies Inc., a developer of post-quantum cryptography hardware IP, today published the development timeline of its ML-DSA hardware cryptographic engine. The engine passed the U.S.
Design And Reuse

BOS Semiconductors Partners with LG Electronics and HANA Micron to Advance Domestic Development of Chiplet-Based Automotive Semiconductors

BOS Semiconductors, a fabless semiconductor company specializing in Physical AI and automotive semiconductors, has joined forces with LG Electronics, HANA Micron, and other partners to advance the ...
Design And Reuse

Two AI Brains Are Better Than One

Qualcomm calls its sensing engine the Sensing Hub. Its 2024 whitepaper describes “an extremely efficient always-on AI ...
Design And Reuse

Tenstorrent Announces a $1.5B Series E at a $6.2B valuation

October 19, 2026 -- Tenstorrent, the AI computing company, has closed $1.5B in Series E funding at a $6.2B post-money valuation.
Design And Reuse

TSMC to Double 2nm Production Capacity by 2027, Widening Gap with Samsung Foundry to 66.6 Percentage Points

TSMC has announced plans to more than double its annual 2nm process production capacity by 2027 compared to this year. The company's 2nm revenue share reached 8% in Q3, up 5 percentage points from the ...
Design And Reuse

Intel CEO Lip-Bu Tan stresses that US government investing billions in the company does not mean chip maker is not 'independent', says: They don't have any policy to …

Intel CEO Lip-Bu Tan has defended the company's independence from the US government. Tan clarified that the US government's multibillion-dollar investment in the chipmaker does not give Washington ...
Design And Reuse

How Chiplets Could Transform Server Design – And Data Centers

Chiplets are reshaping CPU design, enabling data centers to do more without increasing space or power consumption. By Christopher Tozzi,Technology Analyst, datacenterknowledge.com ...
Design And Reuse

IBM and Siemens team up to advance 3D nanostack chip technology

IBM and Siemens have announced a research collaboration to advance IBM’s 3D nanostack transistor architecture, targeting the design and manufacturing challenges of future angstrom-scale semiconductors ...
Design And Reuse

As AI transforms organizations, more clear processes become even more important

This year’s lecture connected the opportunities of AI with the need for more clear processes and routines, change fatigue, and the increasing demands that technological development places on boards ...
Design And Reuse

Q1 FY27 Report: Second customer begins silicon validation as Weebit advances commercialization

October 16, 2026 – Weebit Nano Ltd ( ASX: WBT, Weebit or Company) provides this activity report for the quarter ended 30 September 2026 ( Q1 FY27 ), along with the Company’s Appendix 4C cash flow ...
Design And Reuse

Samsung May Acquire a Silicon Photonics Company to Challenge TSMC

Samsung is reportedly considering an acquisition in the silicon photonics space as it looks to close the gap with TSMC in advanced chip packaging. The technology could help Samsung meet growing demand ...
Design And Reuse

GlobalFoundries expands US chip investment to $5 billion

GlobalFoundries has increased its capital investment in US semiconductor manufacturing facilities to $5 billion. This expansion is supported by an amended CHIPS Program award of up to $955 million.