Oct-15th-2025-- GlobalFoundries has been selected as the technology provider and operator for two new semiconductor fabs ...

SEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149 ...

Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...

ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate ...

Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the ...

GlobalFoundries says the Malta site is expected to become the first U.S.-based source of silicon interposers supporting advanced packaging technologies. The planned capability also includes ...

Choosing an Arm CPU core starts with the workload, not with the processor name. The right core depends on what the chip must do, the software it must run, the power and area available, whether ...

TSMC reported US$40.2 billion in second-quarter revenue and a 60.3% operating margin. High-performance computing accounted for two-thirds of revenue, while 2nm made its first measurable contribution ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during ...

Finding experienced ASIC verification engineers can be difficult when your chip project requires strong UVM, SystemVerilog, coverage, formal verification, protocol knowledge or complex SoC-level debug ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, proven HBM integration and the most demanding chiplet-to-chiplet bandwidth are ...