This is not the first foray for Intel in the foundry services space. Back in 2013, Intel made its first attempt and started offering production of chips for Altera using the 14nm process. Soon after a ...

In order to cater to the computing demands for high performance computing (HPC) and artificial intelligence (AI), a need for a scalable package was felt. Chip-on-wafer-on-substrate (CoWoS) refers to ...

Today, VLSI design flow is a very solid and mature process. The overall VLSI design flow and the various steps within the VLSI design flow have proven to be both practical and robust in multi-millions ...

SEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149 ...

Oct-15th-2025-- GlobalFoundries has been selected as the technology provider and operator for two new semiconductor fabs ...

Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...

ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate ...

Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the ...

You read the term “negative delay” and your engineer mind goes racing creating science fictions – time machine, time generator, non-causal machine and so on. Here are the answers – no, you can’t turn ...

United Microelectronics Corp (UMC), Taiwan’s second-largest pure-play wafer foundry, marked a milestone yesterday with the arrival of the first equipment tools for its Phase 3 expansion at Fab12i in ...

[Oct 29, 2024] – The global semiconductor market is poised for significant growth in the coming years, fueled by the continued surge in demand for AI-related semiconductors and a recovery in ...

Minimizing the PCB footprint and the BoM cost implies embedding the Power Regulation Network (PRNet) in the SoC. Meanwhile, minimizing drastically the SoC power consumption involves implementing ...