The course handbook, Printed Circuit Engineering Professional, was authored by Michael Creeden, Stephen Chavez, Rick Hartley, Susy Webb and Gary Ferrari, industry veterans who combined have more than ...
AUSTIN TX - High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s ...
MILPITAS, CA — Printed circuit board and multichip module design software revenue dropped 15.4% in the second quarter to $364.2 million, the ESD Alliance announced today. The four-quarter moving ...
MALTA, NY -- GlobalFoundries plans to build and operate two new semiconductor fabrication plants at its Malta, NY, complex under a US-Japan trade and investment agreement that includes up to $21 ...
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