Global smartphone shipments tanked 22% YoY in 3Q 2026, marking the highest YoY decline to date of any quarter amid the AI-led ...

ST's HELIX research program with NUS will explore how memory, processing and software can be designed together for real-time ...

The new Singapore hub will consolidate regional logistics and shift sales operations closer to customers across Southeast ...

The agreement shifts Infineon's existing supply relationship with Wolfspeed to larger-diameter substrates for SiC ...

AST's 95,000-square-meter plant will produce large-body, high-layer-count substrates for AI computing and networking chips.

Higher component costs and longer replacement cycles weakened China’s smartphone market, while Huawei recorded double-digit ...

Targeted enclosure upgrades can help engineers improve shielding above 40GHz while preserving existing cabinet architecture ...

Coralboard offers a practical starting point for rapid prototyping, product evaluation, and production-oriented edge AI ...

TSMC turns to GlobalFoundries for silicon interposers to expand advanced packaging capacity and support future customer ...

OLED notebook panel shipments are forecast to rise 50% in 2026, driven by premium PCs, Apple adoption and manufacturing ...

Nordic's Bluetooth LE SoCs have powered the educational board since 2016, reaching 73.5 million young people across more than ...

UVJC’s first commercial vapor jet printing system targets materials development and process validation for advanced ...