Microchip Technology Inc. has expanded its data center portfolio with new connectivity, storage, and acceleration capabilities designed to meet the performance, security, and scalability needs of AI ...

At the OCP Global Summit, TI unveils three new chips for AI data centers—the 3-GSPS ADC, 800-V hot-swap controller, and BAW oscillator.

Artificial intelligence is reshaping data center architecture by changing where system bottlenecks occur. For years, networking discussions focused primarily on scale-out communication between servers ...

There are several ways to deploy a database on NAND flash memory: over a flash file system, over an FTL-provided block device, or with flash management integrated into the database storage layer. For ...

Chiplet-based FPGAs for space applications split compute and I/O to balance processing capacity, radiation tolerance, power, and lifecycle requirements.

For example, radiation can alter the content of memories, permanently change the characteristics of transistors, or cause temporary circuit blockages. Similarly, extreme temperatures can change key ...

Factories and building automation systems generate massive amounts of operational data from sensors, actuators, motors, and other field devices. Many of these endpoints still operate on two-wire ...

Humanoid robots need a real-time “nervous system” with a distributed architecture to deliver real-time networking and control for coordinated motion.

On July 13, the Pentagon hit pause on the biggest cybersecurity compliance program in the defense industrial base. In a memo signed by DoD chief information officer Kirsten Davies, the department ...

While Nvidia dominated the Computex 2026 stage with its Vera Rubin platform and RTX Spark for agentic AI PCs, AMD announced its agentic AI computer counterparts ahead of the mega tech event. In May, ...

The surge in complexity of modern SoCs, driven by the integration of heterogeneous compute elements, advanced packaging techniques, and stringent power and performance demands, has led to an ...

The MIPI Alliance has released two major updates to its UniPro and M-PHY specifications, targeting JEDEC Universal Flash Storage (UFS 5.0) for edge AI in mobile, PC, and automotive applications. The ...