As AI workloads demand greater memory capacity, chipmakers are exploring alternatives to traditional memory architectures.

NVIDIA is advancing its next-generation co-packaged optics (CPO) technology, with prototypes designed to bring optical engines closer to computing ...

As AI-driven demand extends from DRAM to NAND, Samsung and SK hynix are upgrading their key Chinese facilities. According to Reuters, Samsung plans ...

Samsung Electronics is preparing to expand the use of its in-house processors in its next-generation flagship smartphones.

Apple is expanding its U.S. manufacturing footprint, bringing more domestically sourced components into its latest iPhone ...

As AI accelerator demand fuels the rise of advanced packaging technologies such as CoWoS and EMIB, supply bottlenecks are ...

Intel is expanding its silicon photonics capabilities as demand for high-bandwidth optical interconnects grows across AI and ...

Ahead of its October 31 earnings release, CXMT forecast revenue of RMB 265–270 billion for the first nine months of 2026, ...

China's semiconductor equipment makers are stepping up their push into advanced packaging as demand grows for technologies ...

The memory industry faces growing concerns over technological advances by Chinese rivals, potential HBM specification changes ...

China’s semiconductor equipment makers are showcasing their growing capabilities at WESEMIBAY. According to National Business ...

The rise of agentic AI is reshaping CPU design priorities. According to Wccftech, which interviewed NVIDIA's Vera team, the ...